METLAB LOW CONCENTRATION-METAL BOND continuous rim diamond wafering blades are recommended for most routine very hard brittle sectioning of non-ferrous materials including structural ceramics, electronic substrates, alumina and zirconia

METLAB HIGH CONCENTRATION-METAL BOND-continuous rim diamond wafering blades are recommended for most routine hard brittle sectioning of non-ferrous materials including ceramics, ferrite, carbide, thermal spray coatings, glass, quartz and silicon.

RESIN BONDED DIAMOND WHEELS.
continuous rim diamond blades are recommended for cutting of ferrous metals