Sectioning

Diamond Wafering Blades

3" LOW CONCENTRATION - METAL BOND

M306L
$166.00 USD
EACH

Product Description

METLAB low concentration continuous rim diamond wafering blades are recommended for sectioning of non-ferrous and brittle materials, including ceramics, carbides, re-fractories, silicon, boron composites, glass, and rock. Allows for higher loads being applied at sample interface. Used on lower loads and speeds. 3" X .006" X 1/2"