Diamond Wafering Blades
4" LOW CONCENTRATION - METAL BOND
M412L
Product Description
METLAB low concentration continuous rim diamond wafering blades are recommended for sectioning of non-ferrous and brittle materials, including ceramics, carbides, re-fractories, silicon, boron composites, glass, and rock. Allows for higher loads being applied at sample interface. Used on lower loads and speeds.
4" X .012" X 1/2"