Sectioning

Diamond Wafering Blades

5" LOW CONCENTRATION - METAL BOND

M515L
$200.00 USD
EACH

Product Description

METLAB low concentration continuous rim diamond wafering blades are recommended for sectioning of non-ferrous and brittle materials, including ceramics, carbides, re-fractories, silicon, boron composites, glass, and rock. Allows for higher loads being applied at sample interface. Used on lower loads and speeds. 5" X .015" X 1/2"