Sectioning

Diamond Wafering Blades

6" LOW CONCENTRATION - METAL BOND

M620L
$259.00 USD
EACH

Product Description

METLAB low concentration continuous rim diamond wafering blades are recommended for sectioning of non-ferrous and brittle materials, including ceramics, carbides, re-fractories, silicon, boron composites, glass, and rock. Allows for higher loads being applied at sample interface. Used on lower loads and speeds. 6" X .020" X 1/2"