Diamond/CBN Wafering Blades
3" LOW CONCENTRATION - METAL BOND- PRODUCTION GRADE
M306L-PRO
Product Description
METLAB low concentration continuous rim diamond wafering blades are recommended for sectioning of non-ferrous and brittle materials, including ceramics, carbides, re-fractories, silicon, boron composites, glass, and rock. Allows for higher loads being applied at sample interface. Used on lower loads and speeds.
3" X .006" X 1/2"